0-07-141807-5 The material in this eBook also appears in the print version of this title: 0-07-137169-6.Īll trademarks are trademarks of their respective owners. Except as permitted under the United States Copyright Act of 1976, no part of this publication may be reproduced or distributed in any form or by any means, or stored in a database or retrieval system, without the prior written permission of the publisher.

Manufactured in the United States of America. McGRAW-HILL New York Chicago San Francisco Lisbon London Madrid Mexico City Milan New Delhi San Juan Seoul Singapore Sydney TorontoĬopyright © 2000 by The McGraw-Hill Companies. Kristy D’Arcy Melissa Sherrer Administrative Assistance Olatunji Cunningham Travis Gary Maurice Novembre Alyssa Poole Salley Theodore Illustrators Tummala Georgia Institute of Technology EditorĪngie Hughes Nancy Trent Mahesh Varadarajan Managing Staff You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies-wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology.

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